Submissions

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Submission Preparation Checklist

As part of the submission process, authors are required to check off their submission's compliance with all of the following items, and submissions may be returned to authors that do not adhere to these guidelines.
  • The submission has not been previously published, nor is it before another journal for consideration (or an explanation has been provided in Comments to the Editor).
  • The submission adheres to the requirements outlined in the file (TemplateCien) with format and instructions for authors locate in the folder Gdrive (see below in Author Guidelines).
  • The text is single spaced; employs italics, rather that underlining (except with URL addresses); and all illustrations, figures and tables are placed within the text at the appropiate points, rather than at the end. Tables and Equations are editable not images.
  • Where available, URLs or DOIs for the references have been provided.
  • The submission adheres to the stylistic and bibliographic requirements outlined in the IEEE Editorial Style Manual for Authors (2023).
  • You must have one file to be uploaded to the platform at the time of registration. The submission consists of the text of the article with all the data [Article] and with the references following the IEEE Reference Guide (2023).
  • Author accepts sending his/her paper our Editorial Board Policies.

Author Guidelines

Científica publishes theoretical and experimental research on Electromechanical and Electronics Engineering, Computer Engineering, Telecommunications, and also Education in Engineering. Author accepts sending his/her paper the Editorial Board Policies.

The file (TemplateCien) with format and instructions for authors is locate in this Gdrive folder for download. Also, you could find guidelines in Authors section in our website. More details can be found in both  IEEE Editorial Style Manual for Authors (2023) and IEEE Reference Guide (2023).

Research

Científica publishes theoretical and experimental research on Electromechanical and Electronics Engineering, Computer Engineering, Telecommunications, and also Education in Engineering. Author accepts sending his/her paper the Editorial Board Policies.

Aerospace

Special Issue: Aerodynamics, Structures, Propulsion, Automatic Control, Materials, Programming and Simulation, Autonomous Systems, Remote Sensing, Airports, Maintenance, Aircraft Operations, Design and Manufacturing, Space Systems.

Software Engineering

Special issue: Applications of Software Engineering in Mexico: research and development, technological innovation and economic growth.

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